Appendix
Customer information
Company: Contact Person:
Address: E-mail:
Phone:
Fax:
Technology information If you know the exactly technology name:
Click !
Supply voltage:
3,3 V 5 V 15 V > 40 V
Clock / bandwidth:
MHz Special process option:
Design information
Interface level:
netlist GDSII TDB others:
If netlist:
Number of equivalent gates (nand2): Area of special cells (analog,macrocells) / mm2: Please specify special cells:
Number of input pads: Number of output pads:
Number of bidirectional pads: Number of power pads
(power, gnd, others):
If Layout: Area / mm2
Product requirements
Number of functional devices per year: Production volume total:
Estimated yield (if known): Package type:
Prototypes:
yes no
Number of prototypes:
Testing
Type of test:
Analog Digital Mixed
Test complexity:
Low Medium High
Test vectors:
Functional Scan
Qualification requirement:
Schedule
DD/MM/YY 1. Netlist ready for submission:
2. Layout ready for submission:
3. Test pattern:
4. Prototypes required:
Figure 1.1 Europractice goal definition form
Rood Technology International
Project Summary
Project no. C06-00X
Description:
Application:
Required services: FALSE
FALSE
FALSE
FALSE
FALSE
FALSE
FALSE
Comments:
Schedule and Volume
MPW Prototype:
Mass Production: jan-07
Decision about
technology:
Year 2006 2007 2008 2009
Max volume pcs/wafer
per year
Min volume pcs/wafer
per year
Batch size Wafer/Month/Quarter
Technology
Wafer Manufacturing
Process:
Technology Node
Wafer Size
Die Size:
no of I/O: no of pins:
Additional Specifications:
Test Software
Development
Application: Pattern available?
Function: Prefered test platform
Package/Wafer
Function Description avlbl?
Additional Specifications:
Wafer Sort / Wafer
Project Options and Calculations
Project C06-002
date:
Schedule and Volume
MPW Prototype:
Mass
Production: jan-07 Decision about
technology:
Year 2006 2007 2008 2009
Max volume pcs/wafer
Min volume pcs/wafer
Price indication for different
options at
Foundy Process Price in USD/ X00mm Wafer, based on forecast, Ex
works Shanghai year Probing
Application: Pattern available?
Function: Prefered test platform
Package/Wafer Temperatures:
Function Description avlbl?
Additional Specifications:
Assembly / Packaging
Package:
Transport Packing
Bake Dry Pack
Back grind:
Additional Specifications:
Final Test
Application: Pattern available?
Function: Prefered test platform
Package/Wafer Temperatures:
Function Description avlbl?
Additional Specifications:
Additional Specifications:
Logistics
Special requirements:
Qualification
Required Services
Special requirements:
