Bookings trend through the years including budget 2002
0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0
89 90 91 92 93 94 95 96 97 98 99 00 01 02
Year
Bookings in [ Keuro/YR]
S a le s p e r c u s to m e r & M a r g in 2 0 0 1
E x c l m a te ria l m a n a g e m e n t
0. 0 0 5. 0 0 1 0. 0 0 1 5. 0 0 2 0. 0 0 2 5. 0 0
Infineon STM Avx Ericsso
n Philips
Eems Epcos
Micros em
i
Micronas Osram Delphi
Am kor
Motorola Zet
ex Atlant
ic
T o p 1 5 C u sto m e r s
KK Euro's
0 % 1 0 % 2 0 % 3 0 % 4 0 % 5 0 % 6 0 % 7 0 % S u m o f S ale s m a rgin
Appendix I
Database of the installed base.
System 1 2 3 4 5 6 7 8 9 Total
Infineon Regensburg (De.) 9 1 1 2 13
Malaysia (Malacca) 59 8 8 1 1 1 78
Singapore 5 2 1 4 12
Dresden (De.) 2 2 4
Portugal (Porto) 1 6 2 9
USA (Richmond) 3 1 4
Total 68 1 14 21 1 2 12 1 120
ST Malta 1 6 27 4 1 39
Shenzen 1 8 1 10
Tours Cedex (Fr.) 1 1
Singapore 2 5 7
Malaysia 26 2 28
Agrate Brianza (It.) 1 1
Cantania (It.) 1 1 2
Grenoble Cedex (Fr.) 8 1 9
Morocco 9 1 10
Total 2 9 75 4 16 1 107
Avx Czech Republic 24 24
United Kingdom 1 1
El Salvador 0
Total 24 1 25
Ericsson Kalmar (Sw.) 5 5
USA (Richardson) 1 1
Total 6 6
Philips Stadskanaal (NL.) 1 1
Thailand 4 4
Eindhoven (NL.) 1 1
Total 4 1 1 6
Eems Eems Italy 3 1 4
Singapore
Total 3 1 4
Epcos Epcos Munchen (De.) 2 2
Heidenheim (De.) 0
Total 2 2
Micronas Micronas Freiburg (De.) 11 11
Total 11 11
Osram Regensburg (De.) 1 1
Malaysia (Penang) 1 1
Total 1 1 2
Delphi Singapore 1 7 8
USA 1 4 1 6
Total 2 11 1 14
Amkor USA 1 1
Phillipines P1 3 3
Phillipines P2 1 1
Phillipines P3 14 4 18
Seoul (SK) 17 17
Bucheon (SK) 7 7
Bu Pyung (SK) 16 16
Kwang-Ju (SK) 6 6
Total 60 4 5 69
Motorola Malaysia 1 2 1 4
Tai po (HK) 7 5 12
Kwai Chung (HK) 1 1 2
China 1 1
Tempe (USA) 1 1 2
Appendix II
A p pe nd ix V I
Q1+Q2 2002 Num. 2001 Num. 2000 Num.
Group Companies of % Companies of % Companies of %
cust. cust. cust.
≥ 5% AIT HK, Amkor K2, Eems Italy, Infineon Melaka / Porto, NSEB
6 71.2 Infineon Regensburg, ST Casa Blanca, Eems Italy, On Semicon, ASE Korea, Vicor Andover, Eternal Shanghai
7 51.8 Infineon Melaka, ON SBN, AVX Lanskroun, ST Malta, ST Muar, Infineon Regensburg
6 55.8
≥ 3 - < 5 ASE Korea, Ericsson Sweden, Infineon R'burg, Micronas Freiburg
4 13.4 ST Muar, Infineon Melaka, ASAT HK, AVX Lanskroun, Micronas Freiburg, Changfeng Shanghai
6 21.6 Infineon Singapore, Amkor P3, NSEB, Ericsson Sweden
4 17.9
≥ 1 - < 3 Infineon Dresden, Microsemi USA, ON SBN, Osram R'burg, Philips Philippines, ST Agrate
6 10.6 IBM Canada, Cypress Ph, Osram R'burg, Osram Munchen, ST Malta, Sensonor Norway, Fraunhofer, Amkor P3, Samsung Germany, Alpha USA, NSEB
11 19.4 Microsemi watertown,Motorola China, ST Tours, ST Cantania, Amkor P1, Osram R'burg, SCG SBN, Micronas Freiburg, Eems Rieti, Ericsson Texas, Philips Thailand, Epcos
12 18.8
0 - < 1 Amkor P2, Conexant USA, Epcos Munchen, Philips Stadskanaal, PT Infineon Batam, Robert Bosch, Schurter, SPIL, ST Grenoble / Malta / Muar, Teccor USA
12 4.8 ST Grenoble, ST Cantania, Infineon Richmond, Philips Stk, Motorola China/HK/Tempe, Technorent Karlsfeld, Teccor Irving, Siemens Toulouse, PT Infineon Batam, Hynix Korea, Vishay Austria, Robert Bosch, Atlantic UK, Hei
16 7.2 Motorola HK / KL, Cypress Ph, ST Grenoble / St. Genis / Shenzen / Casa Blanca, Infineon Porto / Dresden, PT Infineon Batam, Amkor K1 / Chandler, AVX Paignton, IBM Canada, NS Maryland, Atlantic Techn.,TSTC Taiwan, Sensonor Norway, Zetex, EDL HK, Nitto Denko, QTM, Philips Bangkok, Intel Folsom / USA, QT Optoelect., Delphi Kokomo / S'pore, Teccor Irving
29 7.5
Top 10 IC companies per world region
Appendix VII
Data about the semiconductor industry
Turnover chip equipment sales Total Packaging market US$ M
2000 $60 miljard 2000 2.2
2002 $36,8 8% YOY 2002 1.36
2007 $100 2007 3.7
Chip equipment sales per segment Chip equipment sales geographilcal (april '02)
Mask 3.20% No. America 29%
Wafer fab 77% Europe 12.20%
Packaging 3.70% Japan 12.50%
Testing 12.90% Korea 10.80% 46.50%
Related 3.20% Taiwan 23.20%
Other 12.30%
Semiconductor sales (IC Insight) Units (miljard) IC (value) Discretes
2000 $204 miljard 373 86.60% 13.40%
2001 $139 -32% 296
2002 $139 0 297 86.20% 13.80%
2003 $167 21% 341
2004 $215 29% 410 86.30% 13.70%
2005 $197 -9% 395
2006 $203 3% 407 85.80% 14.20%
Type of die / package (2002-2006) 54% Small Outline
21% FP / CC (Flat Pack / Chip Carrier) 10% DIP (Dual-in-line Packages)
6% BGA
4% Bare Dice
5% Rest
